Microelectronic Packaging and Ceramic MEMS

The CMD group is developing capability to fabricate multilayer ceramic packages using low temperature cofired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) material systems.

The conventional process of making ceramic packages uses ceramic tapes with screen printed conductor patterns and punched/drilled holes for vias, stacking/aligning the tape layers and laminating them together prior to co-firing. The ceramic stereolithography process is analogous to the tape-based process, with the key advantage that the fabrication (patterning, aligning and laminating) is done automatically on one machine, in contrast to the tape process which uses at least six different machines.

The CMD group has started development on an integrated multilayer ceramic fabrication process that will enable rapid, tool-less fabrication of complex packages. The primary challenge is integration of multi-materials capability with the stereolithography machine. The figures below show laser-deposited silver circuit patterns on LTCC and demonstrate the basic feasibility of the process.

Multilayer LTCC with Silver Conductor Pattern.

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